FEATURES

• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Ultrafast recovery times for high efficiency
• Low forward voltage, low power losses
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/ECand WEEE 2002/96/EC
  

TYPICAL APPLICATIONS

For use in high frequency rectification and freewheeling application inswitching mode converters and inverters for consumer, computer,automotive and telecommunication.

MECHANICAL DATA

Case: DO-214AC (SMA) Epoxy meets UL 94V-0 flammability rating
Terminals: Matte tin plated leads, solderable per J-STD-002 andJESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1Awhisker test, HE3 suffix for high reliability grade (AEC-Q101qualified), meets JESD 201 class 2 whisker test
Polarity: Color band denotes cathode end